Figure 1: Wastes caused to handle test components with high temperature | |
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1. Waste in the cooling process | 2. Waste in the cooling line |
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3. Wasted space for cooling | 4. Waste of defect-free rate decrease due to incorrect test results |
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Figure 2: Common offset method when testing components with a high temperature |
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▼ Graph 1 shows the heat dissipation characteristics of sections ▼
A-D of the tested component as shown in Figure 2.
Issues1:It is difficult to determine which section will have a correlation with the leak measurement, as heat dissipation characteristics differ between different sections of the tested components.
Issues2:Practical application range of thermometers is limited - it can only be used in sections where the temperature of the tested component is exceptionally close to room temperature (±5°C), meaning that they are easily influenced by the surrounding temperature
Graph 1: Differences in heat dissipation characteristics between sections of the tested component | |||
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Temperature drops gradually in sections with large heat capacity |
Temperature of seal base is relatively similar to room temperature |
Temperature drops gradually in section with small heat capacity |
In sections where the contact area with the test component is large, the temperature of the tested component is transferred, increasing the temperature gradually. |
Fukuda's temperature offset system was developed in order to help overcome these issues.
Figure 3: Principle/Measurement of Temperature Offset Graph 2: Differential pressure during FL-612 detection time Graph 3: Differential pressure during TMD unit detection time |
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Graph 4: Correlation between FL-612 and TMD unit |
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▼ A practical temperature offset can be applied by doing calculations based on ▼
the correlation coefficient gained from the method described above (Figure 4).
Figure 4: Measurements before/after the offset being applied |
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▼ The circuitry diagram of the temperature offset measurement circuit system is as follows. ▼
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